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In this work we present an in situ investigation of the interface composition between an In0. 53Ga0. 47As substrate and an Al2O3 oxide grown by molecular beam deposition in ultra high vacuum conditions. In the effort to improve the chemical quality of the interface, reduction of semiconductor-oxygen bonding at the interface can be obtained by growing a few Å thick pure Al layer before starting exposure of the surface to the atomic oxygen flux. Conversely, when a Ge interface passivation layer is intercalated between the semiconductor and the oxide stack, the interface chemistry is governed by Ge reaction with other species (Al, O), leading only to a partial suppression of the interface oxides.
Publication date: 
30 Apr 2011

M Fusi, L Lamagna, S Spiga, M Fanciulli, G Brammertz, C Merckling, M Meuris, A Molle

Biblio References: 
Volume: 88 Issue: 4 Pages: 435-439
Microelectronic Engineering