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The continuous and aggressive scaling in semiconductor technology results in the integration of increasingly complex 3D architectures and new materials. The realization of these downscaled 3D structures requires also further improvement in 3D characterization techniques. In this work, a potential route to improve the accuracy and reliability of the quantitative analysis of 3D nano‐devices is investigated. 3D organic and inorganic reference nanostructures with dimensions and structural ordering resembling those utilized in industrial applications are fabricated and characterized in detail. The 3D organic nanostructures are fabricated exploiting the self‐assembly capability of di‐block copolymers. Subsequent deposition of a thin Al film lead to the formation and realization of nanostructured Al. In addition, different inorganic nanostructures are fabricated using electron beam lithography. The various nanostructures are …
Publication date: 
1 Mar 2018

Masoud Dialameh, Federico Ferrarese Lupi, Philipp Hönicke, Yves Kayser, Burkhard Beckhoff, Thomas Weimann, Claudia Fleischmann, Wilfried Vandervorst, Pavo Dubček, Branko Pivac, Michele Perego, Gabriele Seguini, Natascia De Leo, Luca Boarino

Biblio References: 
Volume: 215 Issue: 6 Pages: 1700866
physica status solidi (a)